Technical Document
Specifications
Brand
ON SemiconductorDiode Configuration
Series
Number of Elements per Chip
2
Application
AGC
Maximum Forward Current
50mA
Maximum Reverse Voltage
50V
Maximum Forward Voltage
920mV
Mounting Type
Surface Mount
Package Type
MCP
Pin Count
3
Maximum Diode Capacitance
0.23pF
Maximum Series Resistance @ Maximum IF
4.5 Ω @ 10 mA
Dimensions
2 x 1.25 x 0.9mm
Height
0.9mm
Length
2mm
Width
1.25mm
Maximum Operating Temperature
+125 °C
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P.O.A.
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P.O.A.
25
Technical Document
Specifications
Brand
ON SemiconductorDiode Configuration
Series
Number of Elements per Chip
2
Application
AGC
Maximum Forward Current
50mA
Maximum Reverse Voltage
50V
Maximum Forward Voltage
920mV
Mounting Type
Surface Mount
Package Type
MCP
Pin Count
3
Maximum Diode Capacitance
0.23pF
Maximum Series Resistance @ Maximum IF
4.5 Ω @ 10 mA
Dimensions
2 x 1.25 x 0.9mm
Height
0.9mm
Length
2mm
Width
1.25mm
Maximum Operating Temperature
+125 °C