Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
NPN
Maximum Continuous Collector Current
500 mA
Maximum Collector Emitter Voltage
50 V
Package Type
SOIC
Mounting Type
Surface Mount
Pin Count
16
Transistor Configuration
Common Emitter
Number of Elements per Chip
7
Minimum DC Current Gain
1000
Maximum Collector Emitter Saturation Voltage
1.6 V
Minimum Operating Temperature
-20 °C
Maximum Operating Temperature
+85 °C
Length
10mm
Height
1.65mm
Width
4mm
Dimensions
10 x 4 x 1.65mm
Product details
Darlington Transistor Arrays, STMicroelectronics
Darlington transistor power drivers are high-voltage, high-current switch arrays containing multiple open-collector Darlington pairs and integral suppression diodes for inductive loads. The high current rating of each output is 500 mA or higher. The inputs are pinned opposite the outputs in the IC package to simplify the application board layout. The interface is standard logic level for TTL or CMOS.
Darlington Transistor Drivers
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€ 0.55
Each (Supplied on a Reel) (ex VAT)
€ 0.654
Each (Supplied on a Reel) (inc. VAT)
Production pack (Reel)
20
€ 0.55
Each (Supplied on a Reel) (ex VAT)
€ 0.654
Each (Supplied on a Reel) (inc. VAT)
Production pack (Reel)
20
Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
NPN
Maximum Continuous Collector Current
500 mA
Maximum Collector Emitter Voltage
50 V
Package Type
SOIC
Mounting Type
Surface Mount
Pin Count
16
Transistor Configuration
Common Emitter
Number of Elements per Chip
7
Minimum DC Current Gain
1000
Maximum Collector Emitter Saturation Voltage
1.6 V
Minimum Operating Temperature
-20 °C
Maximum Operating Temperature
+85 °C
Length
10mm
Height
1.65mm
Width
4mm
Dimensions
10 x 4 x 1.65mm
Product details
Darlington Transistor Arrays, STMicroelectronics
Darlington transistor power drivers are high-voltage, high-current switch arrays containing multiple open-collector Darlington pairs and integral suppression diodes for inductive loads. The high current rating of each output is 500 mA or higher. The inputs are pinned opposite the outputs in the IC package to simplify the application board layout. The interface is standard logic level for TTL or CMOS.