TDK 22nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD

RS Stock No.: 741-4667Brand: TDKManufacturers Part No.: C2012X7R2E223K125AA
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Technical Document

Specifications

Brand

TDK

Capacitance

22nF

Voltage

250V dc

Package/Case

0805 (2012M)

Mounting Type

Surface Mount

Dielectric

X7R

Tolerance

±10%

Dimensions

2 x 1.25 x 1.25mm

Length

2mm

Depth

1.25mm

Height

1.25mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Product details

TDK C Type 0805 Series C0G, X6S, X7R, X7S, X7T, X8R, Y5V Dielectric

TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.

Features and Benefits:

High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR

Applications:

Commercial Grade for general applications including
General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets

0805 Range

Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.

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€ 0.05

Each (In a Pack of 100) (ex VAT)

€ 0.06

Each (In a Pack of 100) (inc. VAT)

TDK 22nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
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€ 0.05

Each (In a Pack of 100) (ex VAT)

€ 0.06

Each (In a Pack of 100) (inc. VAT)

TDK 22nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Stock information temporarily unavailable.
Select packaging type

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quantityUnit pricePer Pack
100 - 400€ 0.05€ 5.00
500 - 900€ 0.05€ 5.00
1000 - 2400€ 0.05€ 5.00
2500 - 4900€ 0.05€ 5.00
5000+€ 0.05€ 5.00

Technical Document

Specifications

Brand

TDK

Capacitance

22nF

Voltage

250V dc

Package/Case

0805 (2012M)

Mounting Type

Surface Mount

Dielectric

X7R

Tolerance

±10%

Dimensions

2 x 1.25 x 1.25mm

Length

2mm

Depth

1.25mm

Height

1.25mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Terminal Type

Surface Mount

Product details

TDK C Type 0805 Series C0G, X6S, X7R, X7S, X7T, X8R, Y5V Dielectric

TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.

Features and Benefits:

High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers
A monolithic structure ensures superior mechanical strength and reliability
Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values
Low self-heating and high ripple resistance due to low ESR

Applications:

Commercial Grade for general applications including
General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets

0805 Range

Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.