331151702562, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 7.15mm x 2.5mm x 6.2mm

RS Stock No.: 773-4261Brand: Wurth ElektronikManufacturers Part No.: 331151702562
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Technical Document

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

6.2mm

Length

7.15mm

Width_SC_PC

2.5mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability

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€ 1.66

Each (In a Bag of 5) (ex VAT)

€ 1.975

Each (In a Bag of 5) (inc VAT)

331151702562, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 7.15mm x 2.5mm x 6.2mm

€ 1.66

Each (In a Bag of 5) (ex VAT)

€ 1.975

Each (In a Bag of 5) (inc VAT)

331151702562, Contact Finger of Gold Plated Beryllium Copper With Mounting Screw 7.15mm x 2.5mm x 6.2mm
Stock information temporarily unavailable.

Buy in bulk

quantityUnit pricePer Bag
5 - 20€ 1.66€ 8.30
25 - 45€ 1.59€ 7.95
50 - 95€ 1.49€ 7.45
100 - 245€ 1.44€ 7.20
250+€ 1.31€ 6.55

Technical Document

Specifications

Material

Gold Plated Beryllium Copper

Fixing Method

Mounting Screw

Thickness

6.2mm

Length

7.15mm

Width_SC_PC

2.5mm

Product details

Wurth Elektronik SMD EMI Contact Fingers - WE-SECF Series

Wurth WE-SECF series contact fingers are composed of gold-plated copper-beryllium for enhanced wear and corrosion resistance and can be SMD assembled by means of a pick-and-place process.

Suitable for automated placement
Material: copper-beryllium (CuBe) gold-plated (Au)
Different types and sizes available
Corrossion-resistant
Wear-resistant
High temperatures and mechenical weight have no influence on the excellent connection properties
Reliable solderability